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Publications

       Preprints
  1. A. Bartel, M. Brunk, M. Günther and S. Schöps. Dynamic Iteration for Coupled Problems of Electric Circuits and Distributed Devices. Preprint 11/16 Bergische Universität Wuppertal, 2011.
  2. G. Ali, A. Bartel, M. Brunk and S. Schöps. A convergent iteration scheme for semiconductor/circuit coupled problems. Preprint 10/17 Bergische Universität Wuppertal, 2010.
       Scientific Journals
  1. M. Brunk and A. Jüngel. Self-heating in a coupled thermo-electric circuit-device model. Journal of Computational Electronics 10(1):163-178, 2011.
  2. M. Brunk and A. Kværnø. Positivity preserving discretization of time dependent semiconductor drift-diffusion equations. To appear in APNUM.
  3. M. Brunk and A. Jüngel. Simulation of thermal effects in optoelectronic devices using coupled energy-transport and circuit models.   Math. Models Meth. Appl. Sci. 18:2125-2150, 2008.
  4. M. Brunk and A. Jüngel. Numerical coupling of electric circuit equations and energy-transport models for semiconductors. SIAM J. Sci. Comput. 30:873-894, 2008.
   
      Book chapters
  1. M. Brunk and A. Jüngel: Numerical simulation of thermal effects in coupled optoelectronic device- circuit systems. In: W. Jäger and H.-J. Krebs, Mathematics - Key Technology for the Future, S. 29-38, Springer, Berlin, 2008.
  
       Proceedings
  1. M. Brunk and A. Jüngel. Heating of semiconductor devices in electric circuits. In: J. Roos, L. Costa (Eds.), Scientific Computing in Electrical Engineering (Proceedings SCEE 2008), Mathematics in Industries, pp. 261-272. Springer, Berlin, 2010. To appear in Proceedings to SCEE, 2008 
  2. M. Brunk. Numerical simulation of thermal effects in electric circuits via energy-transport equations. PAMM, 6:47-50, 2006.
 
       Theses and further publications
  1. M. Brunk. Numerical coupling of thermal-electric network models and energy-transport equations including optoelectronic semiconductor devices. PhD-Thesis. Johannes Gutenberg-Universität Mainz, 2008. 
  2. M. Brunk and A. Jüngel. Mathematik - Grips für Chips: Numerische Kopplung von elektrischen Netzwerken mit Wärmeleitungs- und Halbleitermodellen. In: Der Schlüssel zur Hochtechnologie - Mathematik für Innovationen in Industrie und Dienstleistungen, BMBF, 2007. 
  3. M. Brunk and A. Jüngel. Numerical Coupling of Electric Circuit Equations with the Transient Energy-Transport Equations for Semiconductors. Communications to SIMAI Congress, 2007.
  4. M. Brunk. Implementierung eines Verfahrens für die Impedanztomographie in drei Raumdimensionen. Diploma-Thesis. Johannes Gutenberg-Universität Mainz, 2004.
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Markus Brunk - Fachbereich C - Institut für angewandte Mathematik und numerische Analysis - Bergische Universität Wuppertal | brunk(at)math.uni-wuppertal.de